Latest TySOM Kit Accelerates the Development of AI, DNN and Other Algorithm Acceleration-dependent Applications Plus Aids SoC Prototyping

Aldec’s TySOM-3A-ZU19EG embedded system development board, showcasing at
Embedded World 2019, supports the early co-development and
co-verification of hardware and software.

NUREMBERG, Germany–(BUSINESS WIRE)–Aldec, Inc., a pioneer in mixed HDL language simulation and
hardware-assisted verification for FPGA and ASIC designs, has launched
the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning
Neural Network (DNN) and other applications dependent on complex
algorithm acceleration in firmware.

This much-anticipated addition to Aldec’s popular family of embedded
development kits showcases at Embedded World on booth 4-560 in
Hall 4
, features a Xilinx Zynq® UltraScale+™ ZU19EG FFVB1517 MPSoC,
which has more than 1 million logic cells, and a quad-core ARM®
Cortex-A53 platform running at up to 1.5GHz. The kit provides 64-bit
processor scalability while combining real-time control with soft and
hard engines for SoC prototyping solution, IP verification, graphics,
video, packet processing and early software development.

“This latest addition to the Aldec TySOM range is our most powerful
yet,”
comments Zibi Zalewski, General Manager of Aldec’s Hardware
Division, “and while it is suitable for the development of some of
today’s most complex applications, such as AI and DNN, it is an
extremely scalable solution, so remains a cost-effective proposition for
small to mid-size SoC FPGA and ASIC prototyping. Few if any other
platforms represent a similarly sound and long-term investment.”

The TySOM-3A-ZU19EG is designed to provide flexibility when selecting
peripherals, because of leveraging all the features of the Zynq
UltraScale+.

The kit contains 8GB DDR4 SODIMM Memory for the Programmable Logic (PL)
and 8GB DDR4 SODIMM Memory for the Processing System (PS). It also
includes 2GB NAND memory, supports Micro-SD card storage, SATA storage
and features a 512MB QSPI Flash Memory.

Communication/networking is enabled by 2x Gigabit Ethernet, Wi-Fi &
Bluetooth, CAN, 4× USB 3.0, USB to UART Bridge, USB 2.0 OTG, JTAG USB,
Pmod, QSFP+ and PCIe x1 GEN3/4 connectors.

Multimedia interfaces are provided using DisplayPort, HDMI IN/OUT. To
expand the peripherals, 2× FMC HPC VITA 57.1-2010 compliant connectors
are provided on the board; thus, additional devices can be connected as
FMC Daughter Cards (available from Aldec plus other vendors).

Notes to Editors

About TySOM

TySOM is a family of development boards for embedded applications that
features Xilinx® Zynq™ all programmable module combining FPGA with ARM®
Cortex processor. A plethora of included peripherals makes these boards
useful in various embedded applications like Automotive, IoT, Industrial
automation and embedded HPC.

The family includes TySOM-1,
1A, 2 and 3
boards, which feature Xilinx Zynq-7000 devices, and TySOM
3 and 3A
, which feature Zynq® UltraScale+™ MPSoC devices.

About Aldec

Aldec Inc., headquartered in Henderson, Nevada, is an industry leader in
Electronic Design Verification and offers a patented technology suite
including: RTL Design, RTL Simulators, Hardware-Assisted Verification,
SoC and ASIC Prototyping, Design Rule Checking, CDC Verification, IP
Cores, Requirements Lifecycle Management, DO-254 Functional Verification
and Military/Aerospace solutions. www.aldec.com

Aldec is a registered trademark of Aldec, Inc. All other trademarks or
registered trademarks are the property of their respective owners.

Contacts

Media Contact:
Richard Warrilow
Declaration Limited
T:
+44 (0)1522 789 000

[email protected]

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